发明名称 Method of cutting out chips for a plurality of sensor elements from laminated body
摘要 A sensor element in which breaks and cracks are difficult to be generated, and a manufacturing method thereof are provided. When cutting out a plurality of chips to be the sensor element 101 by cutting a laminated body and burning, the cutting in a state where difference of resistance added to both side surfaces of an cutting edge of a cutting component is small as much as possible is performed by priority. That is, an uniform cutting in a state where resistance added to the both side surfaces of the cutting edge of the cutting component is substantially same is performed by priority, and when the uniform cutting cannot be performed, a nonuniform cutting in a state where resistance added to the both side surfaces of the cutting edge of the cutting component is different is performed. Thereby, the outline shape when seeing a surface perpendicular to a longitudinal direction of the sensor element, having the four angles A, B, C and D, is trapezoid in which the sides AD and BC are substantially parallel to each other, the angles B and C at the side of a heater are not acute, and the angles A and D at the other side are not obtuse.
申请公布号 EP2103930(B1) 申请公布日期 2016.10.19
申请号 EP20090250766 申请日期 2009.03.19
申请人 NGK INSULATORS, LTD.;NGK CERAMIC DEVICE CO., LTD. 发明人 SHINDO, HIROYUKI;ASAI, TOYOHIKO
分类号 G01N27/407;G01N27/419 主分类号 G01N27/407
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