Electrically reconfigurable interposer with built-in resistive memory

摘要

An integrated interposer may include a substrate and a resistive-type non-volatile memory (NVM) array(s). The integrated interposer may also include a contact layer on a first surface of the substrate. The contact layer may include interconnections configured to couple the resistive-type NVM array(s) to a die(s). The resistive-type NVM array(s) may be partially embedded within the contact layer of the integrated interposer.

主权项

1. An integrated interposer, comprising:
a substrate; at least one resistive-type non-volatile memory (NVM) array; a contact layer on a first surface of the substrate including interconnections configured to couple the at least one resistive-type NVM array to at least one die, the at least one resistive-type NVM array being at least partially embedded within the contact layer of the integrated interposer; and peripheral circuitry embedded within the integrated interposer and configured to control access to/from the at least one resistive-type NVM array.