发明名称 |
Electric power converter with a spring member |
摘要 |
An electric power converter includes a semiconductor module, a cooling pipe, a pressing member and a supporting member. A pair of supporting wall portions is disposed so as to sandwich the semiconductor module, the cooling pipe, and the pressing member in an overlapping direction. A semiconductor element includes a small-sized semiconductor element, and a large-sized semiconductor element of which an outer shape is larger than that of the small-sized semiconductor element when projected onto a plane parallel to the overlapping direction. Within the semiconductor module, the large-sized semiconductor element is disposed closer to a connecting end portion side where a connecting portion of the pair of supporting wall portions are disposed than the small-sized semiconductor elements is. |
申请公布号 |
US9502331(B2) |
申请公布日期 |
2016.11.22 |
申请号 |
US201514847357 |
申请日期 |
2015.09.08 |
申请人 |
DENSO CORPORATION |
发明人 |
Sano Tomohisa;Yamahira Yuu |
分类号 |
H01L23/473;H01L23/367;H01L23/40;H01L23/22;H01L23/36;H01L23/00;H01L23/46;H01L25/11 |
主分类号 |
H01L23/473 |
代理机构 |
Oliff PLC |
代理人 |
Oliff PLC |
主权项 |
1. An electric power converter comprising:
a semiconductor module that incorporates two or more semiconductor elements therein; a cooling pipe disposed so as to overlap with the semiconductor module; a pressing member that presses the semiconductor module and the cooling pipe in an overlapping direction; and a supporting member that includes a pair of supporting wall portions that sandwich the semiconductor module, the cooling pipe, and the pressing member in the overlapping direction, and a connecting portion that connects ends of the supporting wall portions; wherein, there are provided a small-sized semiconductor element, and a large-sized semiconductor element of which an outer shape is larger than that of the small-sized semiconductor element when projected onto a plane parallel to the overlapping direction as the semiconductor elements; and the large-sized semiconductor element is disposed on a side closer to the connecting portion than the small-sized semiconductor element is. |
地址 |
Kariya JP |