发明名称 ZrAION films
摘要 Atomic layer deposition (ALD) can be used to form a dielectric layer of zirconium aluminum oxynitride (ZrAlON) for use in a variety of electronic devices. Forming the dielectric layer may include depositing zirconium oxide using atomic layer deposition and precursor chemicals, followed by depositing aluminum nitride using precursor chemicals, and repeating. The dielectric layer may be used as the gate insulator of a MOSFET, a capacitor dielectric, and a tunnel gate insulator in flash memories.
申请公布号 US9502256(B2) 申请公布日期 2016.11.22
申请号 US201614990214 申请日期 2016.01.07
申请人 Micron Technology, Inc. 发明人 Ahn Kie Y.;Forbes Leonard
分类号 H01L21/31;H01L21/28;C23C16/30;C23C16/455;H01L21/314;H01L21/02;H01L49/02 主分类号 H01L21/31
代理机构 Schwegman Lundberg & Woessner, P.A. 代理人 Schwegman Lundberg & Woessner, P.A.
主权项 1. A method comprising: forming zirconium aluminum oxynitride by forming an insulating zirconium compound and an insulating aluminum compound using a monolayer by monolayer sequencing technique and processing the formed insulating zirconium compound and the formed insulating aluminum compound into zirconium aluminum oxynitride; and forming an electrically conductive material adjacent the zirconium aluminum oxynitride.
地址 Boise ID US