| 发明名称 |
PACKAGE METHOD OF SUBSTRATE AND PACKAGE STURCTURE |
| 摘要 |
A package structure includes a substrate and a package plate. A frame is formed of a seal glue arranged between the substrate and the package plate. An underfill is positioned inboard of the frame. The package plate has a spreading surface, and at least one groove is formed in a spreading path of the frame on the spreading surface of the package plate. |
| 申请公布号 |
US2016372526(A1) |
申请公布日期 |
2016.12.22 |
| 申请号 |
US201615245423 |
申请日期 |
2016.08.24 |
| 申请人 |
Shenzhen China Star Optoelectronics Technology Co., Ltd. |
发明人 |
CHEN Lindou;SHI Kai |
| 分类号 |
H01L27/32;H01L51/56;H01L51/52 |
主分类号 |
H01L27/32 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A package structure, comprising: a substrate, a package plate, a frame formed of a seal glue between the substrate and the package plate and an underfill, the underfill being positioned at an inner side of the frame, the package plate comprising a spreading surface, at least one groove being formed in a spreading path of the frame on the spreading surface of the package plate. |
| 地址 |
Shenzhen CN |
