| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a desirable polishing pad when the notch part of a semiconductor wafer is mirror-polished. <P>SOLUTION: A polishing pad for polishing a notch part has an apical end shaped like a convex form modelling after a special concave form of the notch part, each part of the apical end gets in contact exclusively with a portion corresponding to the notch part, and never contacts other parts. For this reason, each corresponding part of the polishing pad is provided with such a different desirable characteristic, thereby making available a desirable polishing pad. For example, a polishing pad may include multilayer polishing pad members on which flexibly deformable polishing pad members and polishing pad members excellent in a withstand load nature are laminated, wherein the characteristic of each layer's exposed part (apical part) can be effectively utilized. <P>COPYRIGHT: (C)2010,JPO&INPIT |
