| 摘要 |
PURPOSE:To manufacture an IC, of a flip-chip, in which the shape of a stud bump is stable. CONSTITUTION:As the tip shape of a capillary 1, a swelled part 1b which is swelled in the axial direction is formed at the outer circumferential part of the tip. Thereby, when a gold wire 2 is cut and torn, the gold wire is cut and torn in a prescribed part 2a, and the shape of a stud bump becomes stable. |
