| 摘要 |
<p>PURPOSE:To increase the degree of integration by increasing the number of wiring on a circuit board even though the size of the circuit board is restricted by placing a mounting supplemental film between a semiconductor equipment and the circuit board. CONSTITUTION:A flat package type semiconductor equipment 4 is connected to electrodes 10 and 11 placed on the top face and is mounted, and an electrode 12 for connecting to circuit board is placed on the bottom face. A mounting auxiliary film 5 connecting electrodes 10 and 11 to electrode 12 is placed on a circuit board 7, and a land 6 and an electrode 12 located and connected to wiring 9 placed on the circuit board 7 are connected together and mounted. Also, the auxiliary mounting film 5 is laminated between two insulation films 2 where the electrodes 10 to 12 connected by wiring 1 is sandwiched. By doing this, the circuit board 7 can be made as a multi-layer, and the size of the circuit board 7 can be increased.</p> |
