发明名称 BACKSIDE ILLUMINATED IMAGING DEVICE, IMAGING APPARATUS AND METHOD FOR MANUFACTURING BACKSIDE ILLUMINATED IMAGING DEVICE
摘要 <p>PURPOSE: A backside illumination type imaging device, an imaging device and a method for manufacturing the same are provided to realize the function of an electric shutter with a reduced fixed-pattern noise by preventing blue sensitivity from reducing and discharging unnecessary charges. CONSTITUTION: A first semiconductor support substrate(2), an insulation layer(9) and a conductive semiconductor layer(11) are successively formed on a silicon on insulator(SOI) substrate(30). A photoelectric transformation area includes a photo-detection unit. A charge transmission unit transmits a signal charge generated from the photoelectric transformation area to an output unit for signal. The first semiconductor support substrate and the SOI substrate are fixed on a second semiconductor support substrate. The first semiconductor support substrate is removed from the SOI substrate. An ion implantation is performed to the conductive semiconductor layer.</p>
申请公布号 KR20100024974(A) 申请公布日期 2010.03.08
申请号 KR20100006465 申请日期 2010.01.25
申请人 FUJIFILM CORPORATION 发明人 UYA SHINJI;NAGASE MASANORI;NAKAHASHI YOSUKE;HACHIYA TORU
分类号 H01L27/146 主分类号 H01L27/146
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