| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a lead frame which is capable of restraining cracking from occurring in the sealing resin of a semiconductor device, and to provide the semiconductor device using the same. <P>SOLUTION: The lead frame A1 includes die bonding pads 1A and 1B where semiconductor chips 5A and 5B are mounted respectively; a lead 3A electrically connected to the die bonding pads 1A and 1B; and frames 4A and 4B connected to the lead 3A. A bridging unit 2 is provided between the die bonding pads 1A and the lead 3A containing inclined parts 22a, 22b, 22c, and 22d that are inclined at an angle with the direction in which the die bonding pad 1A extends toward the lead 3A. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
