| 摘要 |
PROBLEM TO BE SOLVED: To provide a small MEMS device and its manufacturing method simplified to manufacture the small MEMS device in a series of processes. SOLUTION: A movable electrode 5 is formed on a CMOS element 23, and thereby area occupied by the MEMS device 1 on a surface of a substrate can be reduced as compared with a case where a movable electrode 5 is formed in a region separate from the CMOS element 23 to obtain the small MEMS device 1. Formation of the movable electrode 5 and formation of a bump 90 are simultaneously performed in a plating process. The MEMS device 1 therefore can be manufactured in the series of processes of a semiconductor manufacturing process and the manufacturing method can be simplified. COPYRIGHT: (C)2007,JPO&INPIT
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