| 摘要 |
PROBLEM TO BE SOLVED: To obtain a miniaturized high frequency circuit module of which the mounting area is approximately the same as a bare chip semiconductor device. SOLUTION: The high frequency circuit module comprises the bare chip semiconductor device 2, a thin film circuit board 3 of which the external dimensions are approximately the same as the bare chip semiconductor device 2 and a low temperature co-fired ceramics (LTCC) multilayer substrate 4 of which the external dimensions are approximately the same as the bare chip semiconductor device 2. The thin film circuit board 3 has a plurality of junction pads to be electrically joined with the LTCC multilayer substrate 4 on a surface opposed to a surface on which the bare chip semiconductor device 2 is mounted and has a plurality of junction conductors 7 to be joined with the terminals of the bare chip semiconductor device and a plurality of wiring pads connected to the junction pads through via-hole conductors on the surface on which the bare chip semiconductor device is mounted, and the junction conductors are connected to the wiring pads through wiring conductors. COPYRIGHT: (C)2008,JPO&INPIT
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