| 摘要 |
PROBLEM TO BE SOLVED: To provide the method of manufacturing a multilayer electronic component whose defect caused by short circuit and structural defect are reduced. SOLUTION: The method of manufacturing a multilayer capacitor 10 comprises the layer-stacking step of alternately stacking a plurality of first green sheets 20A in which an electrode paste 22 to be a first inner electrode layer 14A is formed by a first paste pattern PA, and a plurality of second green sheets 20B in which the electrode paste 22 to be a second inner electrode layer 14B is formed by a second paste pattern PB. The plurality of first green sheets 20A are sequentially stacked such that the first paste pattern PA is circularly arranged in a surrounding manner, and the plurality of second green sheets 20B are sequentially stacked such that the second paste pattern PB is circularly arranged in the surrounding manner during the layer-stacking step. COPYRIGHT: (C)2008,JPO&INPIT
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