| 摘要 |
PROBLEM TO BE SOLVED: To mount a chip on a substrate while picking up it at high speed without causing any damage. SOLUTION: The device for mounting a chip has a mechanism for taking out a chip stuck to a sheet by means of a pickup head, mounting the chip thus taken out on a substrate by a mounting mechanism, and stripping the chip from the sheet by abutting against the lower surface of the sheet. Preliminary strip operation for facilitating stripping of the chip from the sheet is performed simultaneously with the operation, for mounting the chip on the substrate by the mounting mechanism in parallel therewith in advance of pickup operation of the chip by the pickup head. Consequently, the chip can be picked up at high speed without causing any damage and mounted efficiently on the substrate. COPYRIGHT: (C)2008,JPO&INPIT
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