| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device in which an oscillator such as an SAW (Surface Acoustic Wave) element or a microdevice having a movable portion is built in the functional side and modularized, and a hollow portion for holding the microdevice can be manufactured inexpensively with high yield; and to provide its manufacturing process. SOLUTION: On a device substrate (piezoelectric substrate 10) having a functional element including a movable portion or an oscillator (interdigital electrode 11) formed in the functional side and an electrode (pad electrode 12) for connection with the functional element, an insulation layer (insulation resin layer 16) having a through-opening is formed such that the functional element faces the interior of the through-opening. A lid 20a comprising a layer including a metal foil 17 and closing the through-opening is formed to constitute a hollow portion 18 along with the inner wall face of the through-opening and the functional side of the device substrate, and wiring 20b is formed to be connected with an electrode in the first contact hole penetrating the insulation layer (insulation resin layer 16). COPYRIGHT: (C)2008,JPO&INPIT
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