| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for a flexible board burying a pattern metallic layer in a resin layer even when the metallic layer is thick and forming the surfaces of the resin layer and pattern metallic layer at places on approximately the same plane. SOLUTION: The manufacturing method for the flexible board is composed of a process forming the pattern metallic layers 13 having a thickness within a range of 15 to 200μm on a first resin layer 12 and a process superposing a resin film 14a on the pattern metallic layers 13 for forming second resin layers 14 of a kind different from the first resin layer 12 among the patterns 13a. The manufacturing method is further composed of the process burying the pattern metallic layers 13 to the resin layer 16 consisting of first and second resins by heating and pressing the first resin layer 12, the pattern metallic layers 13 and the resin film 14a. When the thickness of the first resin layer 12 is represented by t1, its heat-deformation temperature by q1, the thickness of the resin film 14a by t2 and the heat-deformation temperature of the resin film by q2, the condition of formula t1<t2 and q1>q2 is satisfied. COPYRIGHT: (C)2008,JPO&INPIT
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