| 摘要 |
PROBLEM TO BE SOLVED: To provide a process for producing a both-surface printed board in which solder bridge is not formed at all when a circuit component having a plurality of lead wires is fixed to the printed board by soldering and short-circuit defects can be prevented completely. SOLUTION: Lead wire of a circuit component is cut in such a length that the distal end of the lead wire does not project from one side of a both-surface printed board when the lead wire is inserted into the through hole of the both-surface printed board. The lead wire of the circuit component is then inserted into the through hole of the both-surface printed board and solder jet stream is applied to one side of the both-surface printed board mounting the circuit component temporarily, thus soldering the lead wire to the through hole. COPYRIGHT: (C)2008,JPO&INPIT
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