APPARATUS OF BONDING SUBSTRATES

摘要

A substrate bonding apparatus is provided to distribute a load applied to a substrate by forming a concavo-convex pattern on a compressive surface of a compression member. A first compression member(100) includes a first compressive surface(120). A second compression member(200) includes a second compressive surface(220) facing the first compressive surface. The second compression member is used for compressing at least two substrates loaded on the second compressive surface and the first compressive member. A concavo-convex pattern is formed on at least one of the first and second compressive surfaces. The concavo-convex pattern is defined by concave parts. The concave parts are formed by removing partially at least one of the first and second compressive surfaces.