| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing apparatus in which a reaction product is hardly deposited in an exhaust pipe and in a reaction device. SOLUTION: A semiconductor manufacturing apparatus 10 has a reaction device 70 for treating a semiconductor substrate in a vacuumed atmosphere, a vacuum pump 80 for exhausting gas in the reaction device, and exhaust piping provided to connect the reaction device 70 and the vacuum pump 80. A coating/heating means 13 for externally heating the piping, a seal member heating means for internally heating a seal member 15, and temperature sensors 14, 16 for detecting temperatures of an exhaust pipe 11 and the seal member 15 are provided in the semiconductor manufacturing apparatus. By the control of temperature controllers 17, 18, temperatures in the exhaust pipe 11 and on the inner surface of the seal member 15 are set higher than the temperature of a reaction product and equal to each other. Consequently, the temperature in the exhaust pipe can become uniform and the reaction product can be suppressed from being segregated. COPYRIGHT: (C)2009,JPO&INPIT
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