发明名称 |
METAL OXIDE SEMICONDUCTOR HAVING EPITAXIAL SOURCE DRAIN REGIONS AND A METHOD OF MANUFACTURING SAME USING DUMMY GATE PROCESS |
摘要 |
A semiconductor device in which sufficient stress can be applied to a channel region due to lattice constant differences. |
申请公布号 |
US2016204203(A1) |
申请公布日期 |
2016.07.14 |
申请号 |
US201615078079 |
申请日期 |
2016.03.23 |
申请人 |
Sony Corporation |
发明人 |
Tateshita Yasushi |
分类号 |
H01L29/165;H01L29/78;H01L29/51;H01L29/45;H01L29/49 |
主分类号 |
H01L29/165 |
代理机构 |
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代理人 |
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主权项 |
1. A semiconductor device comprising:
a silicon substrate; a gate electrode over the silicon substrate; a gate insulating film between the gate electrode and the silicon substrate, the gate insulating film at least including hafnium; as viewed in cross section, an offset spacer between a sidewall film and the gate electrode; a source/drain region in the substrate, the source/drain region having a lattice constant different from a lattice constant of silicon substrate; and a work function control film between the gate insulating film and the gate electrode. |
地址 |
Tokyo JP |