| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing semiconductor chips, capable of thinning a substrate and of dividing it into individual pieces, without causing chips, or the like. <P>SOLUTION: This method for manufacturing semiconductor chips forms semiconductor chips by dividing a substrate 1, which has on its front surface 3 a plurality of functional elements 19 formed into a matrix form, into individual functional elements 19. The method comprises the step of: forming modified regions inside the substrate 1, that serves as cutting start points, by having a laser beam irradiate into a semiconductor substrate 1 with the laser beam focused to a focusing point inside the substrate along cutting lines formed into a matrix form so as to be interposed between adjacent functional devices 19; and grinding the rear face 21 of the semiconductor substrate 1 so that the substrate 1 has a predetermined thickness. A crack 15, generated from the modified region, has already reached the front surface 3 of the substrate 1, prior to the rear surface 21 of the substrate 1 being ground and after the modified region is formed. <P>COPYRIGHT: (C)2010,JPO&INPIT |
