发明名称 半導体装置
摘要 To provide a semiconductor device including a transistor formed using a highly reliable oxide semiconductor. To provide a semiconductor device which can be manufactured with high productivity and high yield by reducing the number of photolithography steps. The semiconductor device includes a first wiring, a second wiring, and a third wiring whose potential is lower than those of the first wiring and the second wiring between the first wiring and the second wiring. In the semiconductor device, the first wiring is electrically connected to the third wiring through a first transistor in which a gate electrode layer is electrically connected to a source electrode layer, the second wiring is electrically connected to the third wiring through a second transistor in which the gate electrode layer is electrically connected to the source electrode layer, and a continuous oxide semiconductor film used for a semiconductor region of the first transistor and the second transistor is provided above or below the first wiring, the second wiring, and the third wiring.
申请公布号 JP6013570(B2) 申请公布日期 2016.10.25
申请号 JP20150162482 申请日期 2015.08.20
申请人 株式会社半導体エネルギー研究所 发明人 三宅 博之
分类号 H01L29/786;G02F1/1368;H01L21/8234;H01L27/08;H01L27/088;H01L51/50;H05B33/14 主分类号 H01L29/786
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