Solar cell and method for manufacturing the same, and solar cell module

摘要

A solar cell includes a first conductive type semiconductor substrate in which a through hole is formed, a second conductive type impurity diffusion layer provided on one-surface side of the semiconductor substrate, a light-receiving surface electrode provided to be electrically connected to the impurity diffusion layer, a lead-out electrode led out to the other-surface side of the semiconductor substrate via the through hole and provided to be electrically connected to the light-receiving surface electrode, and a back-surface electrode electrically connected to the semiconductor substrate on the other-surface side of the semiconductor substrate and electrically separated from the lead-out electrode. The lead-out electrode contains a metal member inside the through hole and is electrically connected to the light-receiving surface electrode.

主权项

1. A solar cell comprising:
a first conductive type semiconductor substrate in which a through hole is formed, the first conductive type semiconductor substrate possessing a one-surface side and an other-surface side; a second conductive type impurity diffusion layer that is provided on the one-surface side of the semiconductor substrate; a light-receiving surface electrode that is provided to be electrically connected to the impurity diffusion layer on the one-surface side of the semiconductor substrate; a lead-out electrode that is led out to the other-surface side of the semiconductor substrate via the through hole, and is provided to be electrically connected to the light-receiving surface electrode; and a back-surface electrode that is electrically connected to the semiconductor substrate on the other-surface side of the semiconductor substrate, and is electrically separated from the lead-out electrode, wherein the lead-out electrode is formed by a metal member that is constituted by a pair of a male member and a female member, the male member and the female member being connected via the through hole, wherein a protruding portion of the male member is configured to fit in a cylindrical protruding portion of the female member, and the male member and the female member sandwich the semiconductor substrate, thereby fixing the metal member and the semiconductor substrate.