THERMOSETTING RESIN COMPOSITION, MANUFACTURING METHOD OF HEAT CONDUCTIVE RESIN SHEET, HEAT CONDUCTIVE RESIN SHEET AND SEMICONDUCTOR DEVICE FOR ELECTRIC POWER

摘要

PROBLEM TO BE SOLVED: To provide a heat conductive resin sheet good in handling ability at an uncured state and semi-cured state, excellent in heat resistance, heat conductivity and electrical insulation property and a semiconductor device for electric power having high performance and high credibility.SOLUTION: There is provided a thermosetting resin composition where a heat conductive filler 3 is dispersed in a thermosetting resin matrix 2, where the filler 3 is a secondary aggregate 3 obtained by aggregating primary particles 4, the resin matrix 2 is adjusted so that glass transition temperature after curing is 170°C or more and viscosity at 100°C before initiation of curing is 20 Pa s or less.SELECTED DRAWING: Figure 3