| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent bubbles from staying in a mold resin. SOLUTION: This semiconductor device includes an island 12, and a chip 14 is mounted to the island 12. Concretely speaking, the chip 14 is mounted by being shifted to the downstream side in a direction (A direction) for allowing a mold resin to flow when casting the mold resin (mold package) in reference to the center of the island 12. In other words, an end 12a of the island 12 is brought closer to an end face 14a of the chip 14 at the downstream side of the flow direction of the mold resin. Therefore, the mold resin flowing at the lower side of the island 12 can be routed to an area near the end face 14a of the chip 14. As a result, bubbles generated when casting the mold resin are rolled within the mold resin for flowing.</p> |
