MULTICHIP MODULE

摘要

PROBLEM TO BE SOLVED: To provide a multichip module mounting structure using inexpensive lead-free metallic balls which have corrosion resistance even when the balls are not plated and have shock absorbing properties and are excellent in sphericity even when the balls have sizes of >1 mm. SOLUTION: A multichip module 6 is connected to a mother substrate 5 through the metallic balls 4. The metallic balls 4 are made of a brass material, and the solder used for connecting the metallic balls 4 to the mother substrate 5 or the metallic balls 4 to the multichip module 6 is lead-free solder. COPYRIGHT: (C)2005,JPO&NCIPI