MICRO PROCESSING DEVICE USING ULTRASONIC VIBRATION, SIMPLY ACHIEVING ACCURACY AT LOW COST

摘要

PURPOSE: A micro processing device using ultrasonic variation is provided to minutely adjust the cutting depth of a processing tool and to enable high-accuracy fine processing without a high-power mechanical component by utilizing a simple oscillator. CONSTITUTION: A micro processing device using ultrasonic variation comprises a workpiece feed unit(10), a processing tool(20), and an upper and lower position-adjusting unit(30) of the processing tool. The micro processing device includes an oscillator(40) and power supply units(50) supplying a high-frequency power source having each different phase difference to two pair of electrodes(51). The oscillator includes a piezo-electric element(41) receiving high-frequency power sources through the electrodes each connected across the square flat plate-type piezo-electric element combined to the processing tool and has ultrasonic vibration by an elliptic coordinate.