| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a chemically amplified positive resist composition good in various resist performances such as resolution, sensitivity and pattern shape, particularly good in line edge roughness. <P>SOLUTION: The photosensitive resin composition contains (A) a resin which comprises 5-50 mol% of a polymerized unit of formula (I), 5-50 mol% of a polymerized unit of formula (II) and 5-50 mol% of a polymerized unit of formula (III) and/or formula (IV), and (B) a compound which generates an acid upon irradiation with light or radiation. In the formula (I), R<SP>1</SP>is H or methyl; R<SP>2</SP>is alkyl; R<SP>10</SP>is halogen, hydroxyl, alkyl or alkoxy; and n is an integer of 0-3. In the formula (II), R<SP>102</SP>is H or methyl; R<SP>11</SP>is alkyl or alkoxy; and m is an integer of 0-3. In the formula (III) and formula (IV), R<SP>103</SP>and R<SP>104</SP>are each H or methyl; R<SP>3</SP>and R<SP>4</SP>are each alkyl; R<SP>12</SP>and R<SP>13</SP>are each alkyl or alkoxy; and p and q are each an integer of 0-3. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
