| 摘要 |
PROBLEM TO BE SOLVED: To enable a wafer subjected to full cut in a dicing apparatus to be picked up without chipping. SOLUTION: A wafer individualization method comprises the steps: of sticking the rear surface of the wafer on a dicing tape stretched over a ring-shaped dicing frame; of positioning and fixing the wafer onto a work table of the laser dicing apparatus together with the dicing frame; of fully cutting the wafer by the laser dicing to individualize it to a plurality of chips; of sticking protective tape on the surface of the wafer subjected to full cut; of transferring the wafer along with a dicing frame to a die bonder; of peeling off the protective tape from the surface of the wafer; and of expanding the dicing tape by the expanding function of the die bonder to increase the spacing between individual chips so that they can be picked up. COPYRIGHT: (C)2006,JPO&NCIPI |
