FABRICATION METHOD OF WAFER-LEVEL FLIP CHIP PACKAGE USING ACF/NCF SOLUTION

摘要

A method for fabricating a wafer-level flip-chip package using an ACF/NCA solution is provided to effective suppress shadow effect by directly coating a material of a solution stage having a composition of an ACA(anisotropic conductive adhesive) film or NCA(non-conductive adhesive) film on a wafer. After a mixture solution including insulation polymer resin, a hardening agent and an organic solvent is deposited on a wafer(100) with a non-solder bump(113), the deposited mixture solution(115) is dried to transform the mixture deposited on the wafer into a B-stage. The dried wafer is diced into individual chips. After the diced semiconductor chips(200) are aligned with an electrode of a substrate(300), heat and pressure is applied to perform a flip-chip bonding process. The mixture solution can include a conductive particle having 5~20 weight percent with respect to the insulation polymer resin.