| 摘要 |
PROBLEM TO BE SOLVED: To prevent degradation of a cleaning effect due to accumulation of particles on a cleaning brash in cleaning a substrate. SOLUTION: In a state where two cylindrical cleaning brushes 11 and 12 are arranged in parallel to each other on a polishing object surface of a semiconductor substrate 4 after being polished, and one-side cleaning brush 11 out of the two cleaning brushes 11 and 12 is brought into contact with the semiconductor substrate 4, and the other-side cleaning brush 12 is brought into contact with the one-side cleaning brush 11 by being separated from the semiconductor substrate 2, the semiconductor substrate 4 is cleaned while supplying a cleaning fluid 19 from one-side nozzle 17. COPYRIGHT: (C)2009,JPO&INPIT
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