| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a base material with a bonding film which can be bonded efficiently under low temperature to an adherend firmly with high dimensional accuracy, and a method for manufacturing a base material with a bonding film which can manufacture such base material with bonding film, and also to provide a method for bonding the adherend and the base material efficiently under low temperature, and a bonded structure with high reliability which is constituted by the base material with bonding film and the adherence being bonded firmly with high dimensional accuracy. SOLUTION: A base material 1 with a bonding film has a substrate 2 (base material) and a bonding film 3, and is bonded to an opposed substrate 4 (other adherend). The bonding film 3 contains a metal atom, an oxygen atom which combines with the metal atom, and a desorption group which combines with either at least the metal atom or the oxygen atom. By irradiation of ultra violet rays, the desorption group existing in the vicinity of a surface 35 desorps from either at least the metal atom or the oxygen atom, thereby in the surface 35 of the bonding film 3, the adhesive property to the opposed substrate 4 is developed. COPYRIGHT: (C)2009,JPO&INPIT
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