| 发明名称 |
COMPOSITIONS AND METHODS FOR CMP OF SEMICONDUCTOR MATERIALS |
| 摘要 |
The present invention provides a chemical-mechanical polishing (CMP) composition suitable for polishing semi-conductor materials. The composition comprises an abrasive, an organic amino compound, an acidic metal complexing agent and an aqueous carrier A CMP method for polishing a surface of a semiconductor material utilizing the composition is also disclosed.
|
| 申请公布号 |
US2009156006(A1) |
申请公布日期 |
2009.06.18 |
| 申请号 |
US20070226394 |
申请日期 |
2007.04.30 |
| 申请人 |
ANJUR SRIRAM;DYSARD JEFFREY;FEENEY PAUL;JOHNS TIMOTHY;JENKINS RICHARD |
发明人 |
ANJUR SRIRAM;DYSARD JEFFREY;FEENEY PAUL;JOHNS TIMOTHY;JENKINS RICHARD |
| 分类号 |
H01L21/304;C09K13/00 |
主分类号 |
H01L21/304 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
