| 摘要 |
Provided is a semiconductor device such that, while being small, it is possible to achieve low inductance responding to high speed switching. The semiconductor device includes a plurality of conductive pattern members (14), on each of which is mounted one or a plurality of power semiconductor chips (12A, 12B), and a printed circuit board (16) wherein a chip rod-form conductive connection member (17) connected to the power semiconductor chip and a pattern rod-form conductive connection member (17a, 17b) connected to the conductive pattern member are disposed on the surface opposing the conductive pattern member, wherein the conductive pattern member (14) is formed of a narrow portion (14b) and a wide portion (14a), the narrow portion of at least one conductive pattern member and the printed circuit board are connected by the pattern rod-form conductive connection member (17b), and a current path is formed between the conductive pattern member and the power semiconductor chip connected via the chip rod-form conductive connection member to the printed circuit board. |
