| 摘要 |
The present invention relates to a semiconductor package using an interposer, which prevents cracks caused by stress from occurring in a circuit unit contained in an interposer during a semiconductor package using an interposer is manufactured, and a method for manufacturing the same. That is, the present invention provides a semiconductor package using an interposer which buffers the force or stress in a buffer layer, thereby easily preventing cracks from occurring in the circuit unit of the interposer, and a manufacturing method for the same, even if an external force or stress, generated in a process in which another buffer layer is formed on the circuit unit of the interposer and a semiconductor chip is attached, a molding process of a molding compound resin, and a sewing process of the interposer having the size of a wafer, is focused on a circuit unit of an interposer. |
