| 发明名称 |
Mold-Cooling System and Mold-Cooling Method |
| 摘要 |
A mold-cooling system for cooling a heated mold by supplying cooling medium from a cooling medium supply source to a medium flow path provided for a mold. The mold-cooling system is characterized in that a discharge side path connected to an outlet side of the medium flow path of the mold is communicated with a heat exchanger condensing the cooling medium gasified and discharged from the medium flow path. |
| 申请公布号 |
US2016250685(A1) |
申请公布日期 |
2016.09.01 |
| 申请号 |
US201415027411 |
申请日期 |
2014.10.03 |
| 申请人 |
Kabushikikisha Matsui Seisakusho |
发明人 |
SHIMIZU Motoharu;KUDAMATSU Jun |
| 分类号 |
B22D30/00;B22D46/00;B22C9/06;B22D45/00 |
主分类号 |
B22D30/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A mold-cooling system for cooling a heated mold by supplying cooling medium from a cooling medium supply source to a medium flow path provided for a mold, wherein a discharge side path connected to an outlet side of the medium flow path of the mold is communicated with a heat exchanger condensing cooling medium gasified and discharged from the medium flow path. |
| 地址 |
Osaka-shi, Osaka JP |
