Semiconductor device including landing pad

摘要

A semiconductor device includes conductive lines spaced from a substrate, and an insulating spacer structure between the conductive lines and defining a contact hole. The insulating spacer structure is adjacent a side wall of at least one of the conductive lines. The device also includes an insulating pattern on the conductive lines and insulating spacer structure, and another insulating pattern defining a landing pad hole connected to the contact hole. A contact plug is formed in the contact hole and connects to the active area. A landing pad is formed in the landing pad hole and connects to the contact plug. The landing pad vertically overlaps one of the pair of conductive line structures.

主权项

1. A semiconductor device comprising:
a substrate that has an active area; a pair of conductive line structures on the substrate and including insulating spacer structures respectively formed on side walls thereof; a contact plug between the pair of conductive line structures and connected to the active area; a first insulating pattern on the pair of conductive line structures; a second insulating pattern to contact a side surface of the first insulating pattern and a top surface of each of the insulating spacer structures; and a landing pad connected to the contact plug, formed between the first insulating pattern and the second insulating pattern, and extending to and over the first insulating pattern to vertically overlap one conductive line structure of the pair of conductive line structures.