Semiconductor device and method for manufacturing semiconductor device

摘要

A semiconductor device according to the present invention has a semiconductor module 2; a cooling unit 3, the semiconductor module 2 being joined to an upper surface of the cooling unit 3, and a pipe 14, 15 for circulating a refrigerant being fixed to a side surface 20, 22 of the cooling unit 3; and a resin mold layer 4 that covers outer peripheries of the semiconductor module 2 and the cooling unit 3. Further, a protruding portion 25, 26 that protrudes from the side surface 20, 22 of the cooling unit 3 and surrounds the pipe 14, 15 is provided on the side surface 20, 22 of the cooling unit 3.

主权项

1. A semiconductor device comprising:
a semiconductor module; a cooling unit, the semiconductor module being joined to an upper surface of the cooling unit, and a pipe for circulating a refrigerant being fixed to aside surface of the cooling unit; a resin mold layer that covers outer peripheries of the semiconductor module and the cooling unit, a peripheral surface of the resin mold layer being exposed; and a protruding portion that is provided on the side surface of the cooling unit and protrudes from the resin mold layer and surrounds the pipe.