| 发明名称 | Tim strain mitigation in electronic modules | ||
| 摘要 | A lid including a lid body, and a wing portion, the wing portion being disposed on a die side of the lid body such that an edge of the wing portion is flexible independent from a portion of the lid body adjacent to the edge of the wing portion. | ||
| 申请公布号 | US9437519(B2) | 申请公布日期 | 2016.09.06 |
| 申请号 | US201414189597 | 申请日期 | 2014.02.25 |
| 申请人 | International Business Machines Corporation | 发明人 | McVicker Gerard;Sri-Jayantha Sri M. |
| 分类号 | H01L23/367;H01L23/04;H01L23/00;H01L23/42 | 主分类号 | H01L23/367 |
| 代理机构 | McGinn IP Law Group, PLLC | 代理人 | Percello, Esq. Louis J.;McGinn IP Law Group, PLLC |
| 主权项 | 1. A heat spreading lid comprising: a lid body; and a wing portion, the wing portion being disposed on a die side of the lid body such that an edge of the wing portion is flexible independent from a portion of the lid body adjacent to the edge of the wing portion, wherein a thermal interface material is disposed between the die and the wing portion such that the wing portion moves with the thermal interface material independently from the lid body. | ||
| 地址 | Armonk NY US | ||