| 发明名称 | Semiconductor circuit device, electronic apparatus, and moving object | ||
| 摘要 | A semiconductor circuit device includes: a semiconductor circuit provided on a main surface of a semiconductor substrate; and a thin film circuit element including a conductive thin film and disposed on the main surface of the semiconductor substrate. The semiconductor circuit is provided between the thin film circuit element and a peripheral portion of the semiconductor substrate in a plan view. | ||
| 申请公布号 | US9444399(B2) | 申请公布日期 | 2016.09.13 |
| 申请号 | US201514807236 | 申请日期 | 2015.07.23 |
| 申请人 | Seiko Epson Corporation | 发明人 | Nomura Masataka;Kobayashi Hitoshi |
| 分类号 | H03B5/12;H03B5/04 | 主分类号 | H03B5/12 |
| 代理机构 | Harness, Dickey & Pierce, P.L.C. | 代理人 | Harness, Dickey & Pierce, P.L.C. |
| 主权项 | 1. A semiconductor device comprising: a semiconductor circuit provided on a main surface of a semiconductor substrate; a thin film circuit element disposed to face the main surface of the semiconductor substrate and including a conductive thin film; an insulating film provided over the main surface of the semiconductor substrate so that the semiconductor circuit is completely covered by the insulating film; and an external connection terminal provided on a top surface of the insulating film, wherein the semiconductor circuit is provided between the thin film circuit element and a peripheral of the semiconductor substrate in a plan view, and the semiconductor circuit is completely overlapped with the external connection terminal in the plan view. | ||
| 地址 | JP | ||