| 发明名称 |
DISPLAY DEVICE |
| 摘要 |
A structure including a first resin layer and a second resin layer sandwiching a self-light emitting element layer, a first stopper layer, a first resin sacrificial layer and a first glass substrate which are stacked on the first resin layer on the opposite side of the self-light emitting element layer, and a second glass substrate stacked on the second resin layer is prepared. The first glass substrate is peeled off from the first resin sacrificial layer by irradiating the first glass substrate with a laser beam. The first resin sacrificial layer is decomposed by a chemical reaction using a gas. The first stopper layer has a resistance to the chemical reaction, and the first resin sacrificial layer is removed while leaving the first stopper layer in a step of decomposing the first resin sacrificial layer. |
| 申请公布号 |
US2016276625(A1) |
申请公布日期 |
2016.09.22 |
| 申请号 |
US201615070604 |
申请日期 |
2016.03.15 |
| 申请人 |
Japan Display Inc. |
发明人 |
WATABE Kazufumi;KAWANAGO Hiroshi |
| 分类号 |
H01L51/52;H01L51/56;H01L27/32 |
主分类号 |
H01L51/52 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of manufacturing a display device comprising the steps of:
preparing a structure including a self-light emitting element layer which plural self-light emitting type pixels comprise, a first resin layer and a second resin layer sandwiching the self-light emitting element layer, a first stopper layer stacked on the first resin layer on the opposite side of the self-light emitting element layer, a first resin sacrificial layer stacked on the first stopper layer on the opposite side of the self-light emitting element layer, a first glass substrate stacked on the first resin sacrificial layer on the opposite side of the self-light emitting element layer, and a second glass substrate stacked on the second resin layer on the opposite side of the self-light emitting element layer; peeling off the first glass substrate from the first resin sacrificial layer by irradiating the first glass substrate with a laser beam; and decomposing the first resin sacrificial layer by a chemical reaction using a gas, wherein the first stopper layer has a resistance to the chemical reaction, and the first resin sacrificial layer is removed while leaving the first stopper layer in the step of decomposing the first resin sacrificial layer. |
| 地址 |
Tokyo JP |
