| 发明名称 |
CHIP PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME |
| 摘要 |
A chip package structure and method of manufacturing the same are provided. The chip package structure includes a substrate with a carrier surface, a chip having a first surface and a second surface positioned oppositely and a side surface connecting the first surface and the second surface, an encapsulation layer and a fluorescent layer. The second surface of the chip is disposed on the carrier surface of the substrate. The fluorescent layer fully covers the first surface of the chip. The encapsulation layer covers the carrier surface of the substrate and the side surface of the chip. A reflectivity of the encapsulation layer is at least greater than 90%. |
| 申请公布号 |
US2016276546(A1) |
申请公布日期 |
2016.09.22 |
| 申请号 |
US201615073672 |
申请日期 |
2016.03.18 |
| 申请人 |
Genesis Photonics Inc. |
发明人 |
Lee Hao-Chung;Hung Chin-Hua;Hung Cheng-Wei;Chang Jui-Fu;Lin Yu-Feng |
| 分类号 |
H01L33/50;H01L21/78;H01L33/54;H01L33/48;H01L25/075;H01L33/62 |
主分类号 |
H01L33/50 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A chip package structure, comprising:
a substrate, having a carrier surface; a chip, having a first surface and a second surface which are opposite to each other and a side surface connecting the first surface and the second surface, wherein the second surface of the chip is disposed on the carrier surface of the substrate; a fluorescent layer, fully covering the first surface of the chip; and an encapsulation layer, covering the carrier surface of the substrate and the side surface of the chip, wherein a reflectivity of the encapsulation layer is at least greater than 90%. |
| 地址 |
Tainan City TW |
