| 发明名称 |
COVER GLASS FOR LIGHT EMITTING DIODE PACKAGE, SEALED STRUCTURE, AND LIGHT EMITTING DEVICE |
| 摘要 |
To provide a cover glass for light emitting diode package, which is capable of preventing deterioration in transmittance characteristics during use for a long period of time, and a light emitting device. The cover glass for light emitting diode package has a basic composition comprising, by mass % as calculated as oxides, from 55 to 80% of SiO2, from 0.5 to 15% of Al2O3, from 5 to 25% of B2O3, from 0 to 7% of Li2O, from 0 to 15% of Na2O, from 0 to 10% of K2O (provided Li2O+Na2O+K2O=from 2 to 20%), from 0 to 0.1% of SnO2 and from 0.001 to 0.1% of Fe2O3, it does not substantially contain As2O3, Sb2O3 and PbO, and it has an average thermal expansion coefficient of from 45 to 70×10−7/° C. in a temperature range of from 0 to 300° C. |
| 申请公布号 |
US2016276544(A1) |
申请公布日期 |
2016.09.22 |
| 申请号 |
US201615171051 |
申请日期 |
2016.06.02 |
| 申请人 |
Asahi Glass Company, Limited |
发明人 |
SHIRATORI Makoto;MITSUI Yoko;TAKEDA Satoshi |
| 分类号 |
H01L33/48;C03C3/11;C03C3/093;C03C3/091 |
主分类号 |
H01L33/48 |
| 代理机构 |
|
代理人 |
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| 主权项 |
1. A cover glass for light emitting diode package, characterized in that it has a basic composition comprising, by mass % as calculated as oxides, from 55 to 80% of SiO2, from 0.5 to 15% of Al2O3, from 5 to 25% of B2O3, from 0 to 7% of Li2O, from 0 to 15% of Na2O, from 0 to 10% of K2O (provided Li2O+Na2O+K2O=from 2 to 20%), from 0 to 0.1% of SnO2 and from 0.001 to 0.1% of Fe2O3, it does not substantially contain As2O3, Sb2O3 and PbO, and it has an average thermal expansion coefficient of from 45 to 70×10−7/° C. in a temperature range of from 0 to 300° C. |
| 地址 |
Chiyoda-ku JP |
