METHOD OF MANUFACTURING SEMICONDUCTOR CHIPS

摘要

A method of manufacturing semiconductor chips includes: forming grooves on a front face side of a substrate; and forming grooves on a back face side of the substrate as defined herein, and in manufacturing conditions in which a variation range of a top section of the cutting member having a tapered tip end shape with no top face in the groove width direction changes from a range included in the groove on the front face side to a range away from the groove on the front face side as wear of the cutting member advances, the use of the cutting member is stopped before the variation range changes from the range included in the groove on the front face side to the range away from the groove on the front face side.

主权项

1. A method of manufacturing semiconductor chips comprising:
forming grooves on a front face side of a substrate; forming grooves on a back face side of the substrate communicating with the grooves on the front face side using a rotating cutting member having a tip end section and a thickness thicker than a width of the groove on the front face side from the back face side of the substrate, and dicing the substrate into semiconductor chips having stepped sections that are formed due to the difference between the width of the grooves on the front face side and the width of the grooves on the back face side; and preliminarily processing the tip end section of the cutting member before the grooves on the back face side are formed, wherein the tip end section having a tapered degree in which the stepped section is broken is processed so to have a tapered degree in which the stepped section is not broken.