发明名称 |
PROCESS FOR PRODUCING, FROM AN SOI AND IN PARTICULAR AN FDSOI TYPE SUBSTRATE, TRANSISTORS HAVING GATE OXIDES OF DIFFERENT THICKNESSES, AND CORRESPONDING INTEGRATED CIRCUIT |
摘要 |
An integrated circuit includes a first zone for a first transistor and a second zone for a second transistor. The transistors are supported by a substrate of the silicon-on-insulator type that includes a semiconductor film on a buried insulating layer on a carrier substrate. In the second zone, the semiconductor film has been removed. The second transistor in the second zone includes a gate-dielectric region resting on the carrier substrate that is formed by a portion of the buried insulating layer). The first transistor in the first zone includes a gate-dielectric region formed by a dielectric layer on the semiconductor film. |
申请公布号 |
US2016276451(A1) |
申请公布日期 |
2016.09.22 |
申请号 |
US201514930150 |
申请日期 |
2015.11.02 |
申请人 |
STMicroelectronics (Crolles 2) SAS |
发明人 |
Golanski Dominique;Bidal Gregory;Jeannot Simon |
分类号 |
H01L29/423;H01L29/06;H01L29/08;H01L29/788;H01L29/66;H01L27/12;H01L29/78 |
主分类号 |
H01L29/423 |
代理机构 |
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代理人 |
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主权项 |
1. An integrated circuit, comprising:
a first zone including a substrate of the silicon-on-insulator type comprising a semiconductor film on a buried insulating layer on a carrier substrate; a second zone comprising said carrier substrate and said buried insulating layer but without presence of said semiconductor film; a first transistor in said second zone comprising a first gate-dielectric region resting on the carrier substrate and formed by a portion of said buried insulating layer. |
地址 |
Crolles FR |