发明名称 PROCESS FOR PRODUCING, FROM AN SOI AND IN PARTICULAR AN FDSOI TYPE SUBSTRATE, TRANSISTORS HAVING GATE OXIDES OF DIFFERENT THICKNESSES, AND CORRESPONDING INTEGRATED CIRCUIT
摘要 An integrated circuit includes a first zone for a first transistor and a second zone for a second transistor. The transistors are supported by a substrate of the silicon-on-insulator type that includes a semiconductor film on a buried insulating layer on a carrier substrate. In the second zone, the semiconductor film has been removed. The second transistor in the second zone includes a gate-dielectric region resting on the carrier substrate that is formed by a portion of the buried insulating layer). The first transistor in the first zone includes a gate-dielectric region formed by a dielectric layer on the semiconductor film.
申请公布号 US2016276451(A1) 申请公布日期 2016.09.22
申请号 US201514930150 申请日期 2015.11.02
申请人 STMicroelectronics (Crolles 2) SAS 发明人 Golanski Dominique;Bidal Gregory;Jeannot Simon
分类号 H01L29/423;H01L29/06;H01L29/08;H01L29/788;H01L29/66;H01L27/12;H01L29/78 主分类号 H01L29/423
代理机构 代理人
主权项 1. An integrated circuit, comprising: a first zone including a substrate of the silicon-on-insulator type comprising a semiconductor film on a buried insulating layer on a carrier substrate; a second zone comprising said carrier substrate and said buried insulating layer but without presence of said semiconductor film; a first transistor in said second zone comprising a first gate-dielectric region resting on the carrier substrate and formed by a portion of said buried insulating layer.
地址 Crolles FR