发明名称 TRANSPARENT POLYAMIDE-IMIDE RESIN AND FILM USING SAME
摘要 Disclosed are a transparent polyamide-imide resin and a film using the same, which can be colorless and transparent, can show excellent thermal stability and mechanical properties, and can have low birefringence, making it possible to serve in various fields including a semiconductor insulator, a TFT-LCD insulator, a passivation layer, a liquid crystal alignment layer, materials for optical communication, a protective film for a solar cell, a flexible display substrate and the like.
申请公布号 US2016319076(A1) 申请公布日期 2016.11.03
申请号 US201415107634 申请日期 2014.12.26
申请人 KOLON INDUSTRIES, INC. 发明人 JU Chul Ha;PARK Hyo Jun;JUNG Hak Gee
分类号 C08G73/14;C08J5/18 主分类号 C08G73/14
代理机构 代理人
主权项 1. A polyamide-imide resin, which is an imide of a polyamic acid resulting from copolymerizing an aromatic dianhydride and an aromatic dicarbonyl compound with an aromatic diamine, wherein the aromatic dicarbonyl compound is contained in an amount of 1 to 50 mol % based on a total molar amount of the aromatic dianhydride and the aromatic dicarbonyl compound, the aromatic dianhydride includes (i) 4,4′-hexafluoroisopropylidene diphthalic anhydride (6FDA) and (ii) at least one selected from among cyclobutanetetracarboxylic dianhydride (CBDA) and cyclopentanetetracarboxylic dianhydride (CPDA), and the aromatic diamine includes 2,2′-bis(trifluoromethyl)-1,1′-biphenyl-4,4′-diamine (TFDB).
地址 Gwacheon-si Gyeonggi-do KR