LASER PROCESSING APPARATUS

摘要

Disclosed herein is a laser processing apparatus including a controller. The controller includes a target pattern detecting section performing matching between patterns formed in each device imaged and a key pattern to thereby detect a target pattern included in each device, a spacing detecting section detecting the spacing in a Y direction between the target pattern and an ablation groove formed along each division line by ablation, and a map creating section creating a map showing the spacing in the Y direction between each target pattern and the ablation groove for the plural devices arranged along the ablation groove.

主权项

1. A laser processing apparatus for applying a laser beam to a wafer along a plurality of crossing division lines to form an ablation groove along each division line by ablation, said division lines being formed on a front side of said wafer to define a plurality of separate regions where a plurality of devices are each formed, said laser processing apparatus comprising:
a chuck table for holding said wafer; laser beam applying means having focusing means for applying said laser beam to said wafer held on said chuck table; feeding means for relatively feeding said chuck table and said laser beam applying means in an X direction; indexing means for relatively indexing said chuck table and said laser beam applying means in a Y direction perpendicular to said X direction; an imaging unit for imaging a work area; and a controller; said controller including
a target pattern detecting section performing matching between a key pattern stored in said target pattern detecting section and patterns contained in an image obtained by said imaging unit to thereby detect a target pattern included in each device,a spacing detecting section detecting the spacing in said Y direction between said target pattern and said ablation groove, anda map creating section operating said feeding means to thereby move said wafer held on said chuck table in said X direction with respect to said imaging unit, obtaining the result of detection by said target pattern detecting section for said devices arranged along said ablation groove, and finally creating a map showing the spacing in said Y direction between each target pattern and said ablation groove.