THERMALLY CONDUCTIVE COMPOSITION

摘要

Provided is a thermally conductive composition that exhibits excellent thermal conductivity, has low viscosity and is easy to apply. Specifically provided is a thermally conductive composition comprising (A) a spherical thermally conductive filler and (B) an alkoxysilane compound or a dimethylpolysiloxane, wherein the spherical thermally conductive filler of component (A) is a mixture obtained by blending fillers having different average particle diameters at a specified ratio, and the mixture is obtained by blending in at least 30 mass% of a spherical thermally conductive filler comprising a nitride and having an average particle diameter of 50 μm or greater.