RESIN COMPOSITION, RESIN SHEET, PREPREG, INSULATING MATERIAL, RESIN-SHEET CURED ARTICLE, AND HEAT-DISSIPATING MEMBER

摘要

A resin composition containing a heat-curable resin, a thermally conductive filler, and mica, wherein the proportion of the thermally conductive filler which a filler group (C) constitutes, by volume, is greater than the proportion of the thermally conductive filler which a filler group (B) constitutes, by volume, given that the thermally conductive filler is divided into a filler group (A) having a particle diameter of 10-100μm, inclusive, the filler group (B), which has a particle diameter of at least 1.0μm and less than 10μm, and the filler group (C), which has a particle diameter of at least 0.1μm and less than 1.0μm.