System and Method for Test Key Characterizing Wafer Processing State

摘要

Disclosed herein is a method for forming a test key system for characterizing wafer processing states, the method comprising forming a plurality of shallow trench isolation structures (STIs) on a substrate of a wafer and in a scribe line of the wafer and forming a test key on the substrate of a wafer and in the scribe line of the wafer. Forming the test key comprises forming at least one test key group having a plurality of test key series, each of the plurality of test key series having a plurality of test pads, each one of the plurality of test key series having a first physical characteristic different from the first physical characteristic of other test key series the at least one first test key group.

主权项

1. A wafer, comprising:
at least one dicing street defined on a substrate of the wafer, the at least one dicing street separating die areas; and at least one test key series in the at least one dicing street, the at least one test key series comprising:
a plurality of test pads, each of the plurality of test pads separated from another test pad of the plurality of test pads by a shallow trench isolation structure (STI); wherein each of the plurality of test pads in each of the at least one test key series has at least one fin, each test pad of the plurality of test pads in a test key series having a different number of fins.